PART |
Description |
Maker |
J20.BPACKAGE |
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
CA-QFE32SA-L-Z-T-02 |
Carrier Adaptor (CA); 32 position QFP ZIF socket (mini-grid on .040 centers) to 32 position QFP surface-mountable leadless foot with test points.
|
Ironwood Electronics.
|
RLZTE-1136B RLZTE-1118C RLZTE-1122B RLZTE-114.3B R |
500mW Zener Leadless Diode RLZ Series 300mW Zener Leadless Diode 500mW Zener Leadless Diodes 500mA Zener Leadless Diode 500mW Zener Leadiess Diode RLZ Series 300mW Zener Leadless Diode 500mW Zener Leadless Diode Designed for mounting on small surface areas(LLDS(LL-34)) 500mW Zener Leadless Diode RlZ Series
|
Rohm Diodes Incorporated
|
NTLMS4501N |
Power MOSFET 30 V, 14.7 A, N-Channel, SO-8 Leadless Package
|
ON Semiconductor
|
UVV10Z5LN UVV20Z5LN UVV60Z5LN UVV10R1HN UVV10R1LN |
5x7 mm, 3.3 Volt, LVPECL/LVDS, VCXO VCXO, CLOCK, 0.75 MHz, LVDS OUTPUT ROHS COMPLIANT, CERAMIC LEADLESS PACKAGE-6 VCXO, CLOCK, 0.75 MHz, PECL OUTPUT ROHS COMPLIANT, CERAMIC LEADLESS PACKAGE-6 VCXO, CLOCK, 800 MHz, PECL OUTPUT ROHS COMPLIANT, CERAMIC LEADLESS PACKAGE-6 VCXO, CLOCK, 800 MHz, LVDS OUTPUT
|
MTRONPTI
|
SSC-UR202 |
Surface-mounted and leadless chip LED device
|
Seoul Semiconductor
|
1N5711 1N5711UBCA 1N5711UBCC 1N5711UBD |
SCHOTTKY BARRIER DIODES LEADLESS PACKAGE FOR SURFACE MOUNT
|
Microsemi Corporation
|
NTLTS3107PR2G NTLTS3107P05 NTLTS3107P NTLTS3107P-0 |
Power MOSFET -20 V, -8.3 A, Single P-Channel,Micro8 Leadless Package
|
ONSEMI[ON Semiconductor]
|
SLCC16ARB SLCC2003KF SLCC2003MD SLCC2003MF SLCC200 |
Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks
|
VISAY[Vishay Siliconix]
|
SLCC24ARB SLCC24ARD SLCC24ARF SLCC24ARG SLCC24ARH |
Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks
|
Vishay Siliconix
|
SLCC20A01-10KDT0005 SLCC20A03-10KDT0005 SLCC20A06- |
Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks
|
http:// Vishay Siliconix
|